Facilities

  •     8000 sq. ft. Building With Room for Expansion
  •     ESD Safe Work Environment
  •     State of the Art Dicing Saws
  •     Fully Automatic Capability
  •     Inert Gas Filled Wafer/Die Storage
  •     Up to 12"/300mm Dicing Capability
  •     18 Megaohm De-Ionized Water System

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